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[2017-12-05]

  数字集成电路  课程教学大纲

Course Outline

课程基本信息(Course Information

课程代码

Course Code

MR310

*学时

Credit Hours

68

*学分

Credits

4

*课程名称

Course Title

(中文)数字集成电路设计

(英文)Digital Integrated Circuit Design

*课程性质

Course Type

必修课

compulsory course

授课对象

Target Audience

           微电子科学与工程专业(本科生)本科2年级(Grade 2th)

*授课语言

(Language of Instruction)

                              中文(chinese

*开课院系

School

电院

先修课程

Prerequisite

基础电路理论、数字逻辑设计

(Electric Circuit, Digital Logic Design)

授课教师

Instructor

付宇卓

(FU yuzhuo)

课程网址

(Course Webpage)

http://cc.sjtu.edu.cn/portal/CC/Index.aspx

 

*课程简介(Description

(中文300-500字,含课程性质、主要教学内容、课程教学目标等)

本课程是电子工程、电子与计算机工程以及微电子工程专业的基础类课程,也可供有电路基础的计算机专业或相关电类专业本科生的选修课。教学目标包括:

l  知识体系

    领会集成电路在晶体管层次的构成和工艺技术,了解深亚微米半导体平面工艺的特殊性和复杂性;

    掌握集成电路的基本逻辑单元反向器的直流/交流电特性分析;

    熟悉组合逻辑基本电路的各种类型和构成原理,能够运用简单的时延分析估算组合逻辑的时延;

    熟悉运用逻辑努力的方法优化逻辑电路,包括非对称电路和高低扭斜电路优化问题;

    掌握深亚微米工艺下线和互连所面临的问题,能够使用经典Elmore模型分析互连线的RC效应;

    了解时序逻辑的基本分类和构成;

    掌握基本时序电路的构成原理和时序约束,能分析各种类型动态、静态锁存器和触发器的电路原理和特征;

    掌握加法器的各种设计原理,能否运用PG图分析复杂加法器的构成

l  能力

    熟练使用SPICE等工具进行晶体管层次仿真;

    学习Cadence工具的使用技能;

    了解数字集成电路相关技术的国际期刊,训练基本的文献阅读能力,收集当前数字集成电路产业领域的新技术

    专业技术的表达能力

*课程简介(Description

 

DIC is one of the fundamental course for Electric Engineerign,Electric and Computer Engineering, Microelectronic Engineering. Also could be learned as selective course for related majors. Teaching target includes

l  Knowledge level

    Knowledge in transistor level including structure and processing technology, understand those Deep-Submicron processing technology.

    DC/AC characteristic analysis of CMOS inverter.

    Static CMOS layout tricky, VTC data dependency,propagate delay definitions,RC model,Static CMOS size,fan-in/fan-out tech.,Logic effort,CMOS power analysis

    Numeric logical effort characterizes gates,NANDs are faster than NORs in CMOS,Paths are fastest when effort delays are ~4,Path delay is weakly sensitive to stages, sizes.Using fewer stages doesn’t mean faster paths.Delay of path is about log4H stage

    Knowledge about deep submicron wire and interconnect issues, analysis interconnect wire using elmore model

    Sequential logic including Timing,Static Latches and Registers,Dynamic Latches and Registers

    1-Bit full adder structure and complicated adder architecture using PG graph.

l  Ability level

    Transistor level simulation using SPICE tool

    Using cadence tool for layout

    Review the advanced technology through electric journal and library

    Technical communication

课程教学大纲(course syllabus

*学习目标(Learning Outcomes)

基础性

从集成电路器件、反向器、组合逻辑、互联的电路级建模、分析到设计、了解时序电路和算术电路的晶体管级分析和设计。

工程技能训练

运用版图工具的基本设计技能、SPICE的电路分析能力

前沿性包含

未来集成电路设计所面临的Wire 问题、存储器带宽问题,3D IC的热点研究领域

*教学内容、进度安排及要求

(Class Schedule

&Requirements)

No.

Topic

hours

Contents

Comments

1

Chapter1-History of IC

2

History of IC

Moore’s law

China IC Industry

 

Chapter1-Fundamental background 1

2

Bottom-up such as

Device physics

Gate

 

2

Chapter1-Fundamental background 2

2

DIC characteristic

 

Chapter1-Fundamental background 3

2

Logic Flip-flop

Layout fundemental

 

3

Chapter1-CMOS Processing/layout

2

CMOS processing

 

Chapter2-CMOS transistor device

modeling

2

CMOS transistor introduction

Ideal I-V characteristics under static conditions

Velocity Saturation

 

4

Chapter2-CMOS transistor device

modeling

2

Dynamic Characteristics

Nonideal I-V effects

Handing HW1

Chapter2-CMOS transistor device

modeling

2

Dynamic Characteristics

Nonideal I-V effects

 

5

Chapter3-CMOS inverter

Static behavior(1)

2

CMOS inverter at a glance

NMOS inverter,TTL inverter

CMOS interver static behavior

Handing HW2

Chapter3-CMOS inverter

Static behavior(2)

2

CMOS interver static behavior

 Lab1HSPICE/Unix using/layout

6

Workshop1

2

How to Test for IC

 

Chapter3-CMOS inverter

Dynamic behavior(1)

2

CMOS dynamic behavior

Capacitor computing

 

7

Chapter3-CMOS inverter

Dynamic behavior(2)

2

Inverter chain computing

 

8

Chapter3-CMOS inverter

Power analysis

2

Power, Energy, and Energy

Delay

Perspective tech.

Quiz1

SPICE+Exercise Review

 

1+1

SPICE introduction

Exercise Review

Workshop Review1

 Exercise class1

9

Chapter4-

CMOS combinational fundamental

2

CMOS static characteristic

CMOS propagate delay

Large fan-in technology

 

Chapter4-logic effect1

2

Introduction

Delay in a Logic Gate

Multistage Logic Networks

Lab2:CMOS inverter Chain

10

Chapter4-logic effect2

2

Choosing the Best Number of Stages

Example

Summary

define topic3

 

Chapter4-

CMOS combinational ratio-logic

2

Basic concept

Resistive load

Depletion NMOS

Pseudo NMOS

DCVSL logic

Pseudo NMOS logic effort

Handing HW3

11

Chapter4-CMOS dynamic logic

1+1

Dynamic logic principle

Dynamic logic properties

Dynamic logic design issues

Dynamic logic cascade solution

Exercise class3

 

2

Mid Exam

 

12

Chapter5-Datapath adder

 fundamental

2

Full adder various circuit implementation

Manchester Carry Chain

P/G rule

Handing HW4/define workshop topic2

Chapter5-Datapath adder various

 architecture

2

Carry-Ripple Adder

Carry-Skip Adder

Carry-Lookahead Adder

Carry-Select Adder

Carry-Increment Adder

Tree Adder

 

13

Chapter5-Datapath multiplication

2

Unsigned multiplication

Complementation multiplication

Wallace tree

Booth encoder

Serial multiplication

 Lab.combinational 4-bit adder design

Workshop2

1+1

 Low Power Tech.

Exercise class4

14

Chapter6- wire

2

Wire Capacitance

Wire Resistor

Wire crosstalk issue

Elmore module

Handing HW5

Chapter7- Sequential Circuit

timing

2

Timing definition

Min&Max Constrain

Time borrow&Time Skew

Handing HW6

15

Chapter7-Sequential Circuit

static latch&Registers

2

Latch circuit principle

FF circuit principle

Various static FF design

(reset/rest)

Quitz3

Chapter7-Sequential Circuit

dynamic latch&Registers

2

Dynamic FF principle

Various static FF design

Quiz4(datapath)

 

16

Chapter8-memory

2

SRAM general structure

 

Handing HW7

Review/exercise class5

1+1

 Workshop Review2

Exercise class5

17

Q&A

 

 

 Hand Lab1-3

Q&A

 

Final exam

 

*考核方式

(Grading)

(成绩构成)

作业

实验报告

文献报告

评价报告递交

考试

测验

期中考试

期末考试

6*4

4*4

2*4

1*4

4*2

20

22

 

 

*教材或参考资料

(Textbooks & Other Materials)

     Digital integrated circuit Jan M.Rabaey

     CMOS VLSI design- a circuits and systems perspective Meil H.E.Weste, addison wesley press

      “Computer organization and design” John.l.hennessy

     “CMOS IC layout”, dan clein

     “Reuse Methodology manual for system-on-chip designs”, Michael Keating

     “Microelectronic Circuits:Analysis and Design” Muhammad H.Rashid

 

其它

More

 

备注

Notes

 

 

备注说明:

1.带*内容为必填项。

2.课程简介字数为300-500字;课程大纲以表述清楚教学安排为宜,字数不限。

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